CSP Engineering brings innovative parquet production technology to Domotex

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CSP Engineering will be again present in Domotex in 2018.

As developer of technology for the production of wood flooring boards, the company will present the latest innovations, options and opportunities.

 For supporting the producers of wood flooring boards CSP Engineering develops machines which focus on: 

  • The automatic filling of knots and cracks in wooden flooring boards: PAR-Filler®
  • The production for bonding 2-layer parquet: PAR-Duo®
  • Automatic measuring, registering, labelling and packaging of parquet: PAR-Scan®
  • Composing with robot and packaging of colli-fix: PAR-Colli®

 Red thread in everything that CSP Engineering does, is the pro-active tailor-made thinking. Their internal Research & Development Centre allows to formulate solutions responding on the specific individual needs of the wood flooring producers.  'Let's create your solution together!' is their slogan.

Visit CSP Engineering on DOMOTEX hall 13, stand G82

More information: www.csp-engineering.com

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